Tata Electronics Ltd has started exporting limited quantities of semiconductor chips packaged on a pilot line located at its R&D center in Bengaluru.
The packaged chips are being sent to Tata Electronics partners in Japan, the US and Europe, the report said, citing sources. At the same time, the company is preparing to set up a new chip packaging unit in Morigaon, Assam, and a $10 billion chip foundry in Dholera, Gujarat.
Tata Electronics is also in an advanced stage of finalizing the peel-off process for semiconductor chips ranging from 28 to 65 nanometers along with some higher nodes, the report added. It is noteworthy that the chips currently being exported are universal and not tailored to specific applications.
The Dholera chip foundry, a collaboration between the Tata Group and Taiwan’s Powerchip Semiconductor Manufacturing Corporation (PSMC), is expected to have a monthly capacity of up to 50,000 wafer starts. It is expected to manufacture chips in leading nodes such as 28 nanometers and 40 nanometers, as well as in older nodes such as 55 nanometers, 90 nanometers and 110 nanometers.
Also Read
- Uttarakhand Tourism launches India’s first Astro Tourism campaign
- Government lifts ban on onion exports; imposes minimum export price of $550/tonne
Tata Semiconductor Chip Expansion Plans
During the inauguration ceremony of Tata Electronics’ Rs 91,000 crore chip manufacturing plant and Rs 27,000 crore chip assembly plant in Assam in March this year, Tata Sons Chairman N Chandrasekaran unveiled plans for a phased rollout of chips across industries that would generate approximately 72,000 chips. jobs over time. He emphasized that the expansion of the project will only happen after the initial milestones have been reached.
In early February, reports suggested that Tata Group was in talks with Taiwanese companies, including UMC Group and Powerchip Semiconductor Manufacturing Corporation, for a partnership regarding its semiconductor plant in Dholera.
